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Intel introduces Tremont microarchitecture, which will power Surface Neo and other devices

Intel revealed details about its new Tremont microarchitecture at the Linley Fall Processor Conference today. Tremont is the latest low-ability x86 CPU architecture and has a "significant performance boost over prior generations" co-ordinate to Intel. Tremont will integrate with Lakefield CPUs to power the Surface Neo and other devices.

Intel states that Tremont microarchitecture brings pregnant IPC (instructions per cycle) gains when compared to previous generations of Intel'southward depression-power x86 architectures. Intel designed Tremont Microarchitecture for low-power and meaty packages. Intel will integrate the new microarchitecture with Lakefield processors to power devices with new class factors.

Intel Tremont Chief Architect, Stephen Robinson, expands on the new microarchitecure,

Tremont is Intel's about advanced low-power x86 architecture to date. We focused on a range of modern, complex workloads, while because networking, customer, browser and battery so that we could raise operation efficiently across the board. It is a world-class CPU architecture designed for enhanced processing power in compact, low-power packages.

Tremont microarchitecture will integrate with Lakefield CPUs using Intel's Foveros technology. This packaging engineering science allows manufacturers to combine several pieces on a smaller motherboard.

Source: https://www.windowscentral.com/intel-introduces-tremont-microarchitecture-which-will-power-surface-neo-and-other-devices

Posted by: thiesputed1978.blogspot.com

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